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The Latest Breaking News from Samsung Foundry

Samsung reportedly delays purchase of fab tools for fab in Texas — chipmaker allegedly faces challenges with securing clients

Samsung postponed the delivery of new tools from ASML.

Tom’s Hardware

Arm's partners develop 2nm AI processor using Arm's Neoverse — Arm's Total Design ecosystem doubles in size on first anniversary

Arm's Total Design ecosystem is now a year old and has grown to include 30 participants all working on AI chiplet platforms based on Arm's Neoverse CSS V3

Tom’s Hardware

Samsung has no plans to spin off its critical foundry business

Samsung Foundry will remain part of Samsung no matter what, says chairman

Tom’s Hardware

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Samsung's foundry customers reportedly flock to TSMC — three firms move to Taiwanese chipmaker in latest exodus

Small AI chip designers from South Korea increasingly turn to TSMC for their subsequent generations of products after using Samsung Foundry.

Tom’s Hardware

Despite Intel's woes, the U.S. remains the revenue leader of the semiconductor industry

With $264.6 billion in 2023 sales, the U.S. semiconductor industry remains the largest on the planet, and this will not change anytime soon.

Tom’s Hardware

Samsung's yield issues reportedly delays Taylor fab launch to 2026

As Samsung Foundry struggles with yields at below 3nm nodes, it decides to cut personnel at Taylor, Texas fab.

Tom’s Hardware

Chinese companies spend $26 billion on advanced chipmaking machinery investment

Ahead of possible new U.S. export regulations, Chinese chipmakers increase purchases of semiconductor fab tools.

Tom’s Hardware

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U.S. closing critical gap in domestic chipmaking supply chain — GlobalWafers given $400 million to make wafers in the U.S.

The U.S. government provides $400 million to GlobalWafers to support wafer manufacturing in Missouri and Texas.

Tom’s Hardware

Applied Materials' New Deposition Tool Enables Copper Wires to Be Used for 2nm and Beyond

Although the pace of Moore's Law has undeniably slackened in the last decade, transistor density is still increasing with every new process technology. But there is a challenge with feeding power to smaller transistors, as with the smaller transistors comes thinner power wires within the chip, which increases their resistance…

AnandTech

Samsung Foundry to build 2nm processors with HBM for Japanese AI firm

Preferred Networks inks deal with Samsung Foundry to supply 2nm AI processors in 2.5D packaging.

Tom’s Hardware

Samsung's new roadmap unveils its 2nm process nodes and outlines backside power delivery plans

Samsung Foundry outlines roadmap for the next three years: 2nm, backside power delivery and more.

Tom’s Hardware

Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab

To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is…

AnandTech

TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won't be business as usual; chip manufacturers are…

AnandTech

Blacklisted China chipmaker SMIC becomes the world's second-largest pure-play foundry by revenue — outsells GlobalFoundries and others

SMIC becomes the world's second-largest pure-play foundry as it eclipses GlobalFoundries and UMC, but this is only true if you exclude Intel and Samsung.

Tom’s Hardware

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Samsung accelerates race against Intel in glass chip packaging development — glass substrates boost performance

Samsung accelerates construction of glass substrates pilot line, plans to start test production in Q1 2025.

AnandTech

Samsung Tapes Out Its First 3nm Smartphone SoC, Gets A Boost From Synopsys AI-Enabled Tools

This week Samsung Electronics and Synopsys announced that Samsung has taped out its first mobile system-on-chip on Samsung Foundry's 3nm gate-all-around (GAA) process technology. The announcement, coming from electronic design automation Synopsys, further notes that Samsung used the Synopsys.ai EDA suite to place-n-route the layout and verify design of the…

AnandTech

Samsung Foundry Update: 2nm Unveil in June, Second-Gen SF3 3nm Hits Production This Year

As part of Samsung's Q1 earnings announcement, the company has outlined some of its foundry unit's key plans for the rest of the year. The company has confirmed that it remains on track to meeting its goal of starting mass production of chips on its SF3 (3 nm-class, 2nd Generation)…

AnandTech

Arm and Samsung to Co-Develop 2nm GAA-Optimized Cortex Cores

Arm and Samsung this week announced their joint design-technology co-optimization (DTCO) program for Arm's next-generation Cortex general-purpose CPU cores as well as Samsung's next-generation process technology featuring gate-all-around (GAA) multi-bridge-channel field-effect transistors (MBCFETs). "Optimizing Cortex-X and Cortex-A processors on the latest Samsung process node underscores our shared vision to redefine…

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Top News

Samsung And Arm Collaborate On Next-Gen Cortex-X CPU

Samsung and Arm collaborate to develop Cortex-X CPU on Samsung's GAA process technology for enhanced AI capabilities.

AnandTech

GlobalFoundries: Clients Are Migrating to Sub-10nm Faster Than Expected

When GlobalFoundries abandoned development of its 7 nm-class process technology in 2018 and refocused on specialty process technologies, it ceased pathfinding, research, and development of all technologies related to bleeding-edge sub-10nm nodes. At the time, this was the correct (and arguably only) move for the company, which was bleeding money…

AnandTech

ASML to Ship Multiple High-NA Tools in 2025, Expands Production Capacities

ASML began to ship its first High-NA lithography tool to Intel late last year ,and the machine will be fully assembled in Oregon in the coming months. Shipping only a single extreme ultraviolet (EUV) system with a 0.55 numerical aperture lens may not seem like too impressive, but the company…

Tom’s Hardware

OpenAI CEO Sam Altman will be at Intel's next foundry event — and he's currently looking for chip partners

OpenAI's Sam Altman will talk about the importance of advanced chips for AI workloads at Intel's upcoming Direct Connect event in Feb.

Tom’s Hardware

Samsung reportedly trials second-gen 3nm chip production -- full ramp of SF3 node coming later this year

Samsung reportedly starts trial production on SF3 node, which contradicts the company's official SF3 status.

AnandTech

ASML's First High-NA EUV Litho Scanner Arrives At Intel [UPDATED]

Update 1/5/2024: Intel Oregon announced on Thursday that it has received its shipment of ASML's first-generation Twinscan EXE:5000 High-NA EUV lithography scanner. The two companies will start assembly process of the machine shortly and then Intel will start its High-NA learning curve with the aim to insert the technology into…

AnandTech

Intel Reiterates: We Are Not Going to Spin Off IFS

When Intel struggled with its 10nm process technology a few years ago, some investors suggested that the company would be better-off spinning its chip production into an independent foundry, leaving the core of the company to focus on chip design instead. Bucking these calls, however, Intel opted to keep chipmaking…

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